Today, August 2nd 2021, marks the start of INAM's Open Innovation Challenge with Infineon Technologies.
Infineon is looking for thermal interface materials for power modules.
Power modules serve, amongst others, general purpose drives, traction, servo-units and renewable energy applications like solar inverters, energy storage systems or wind applications. They cover a wide range of a few hundred Watts to several Megawatts.
However, with the ongoing demand and system requirement to increase the power density in power electronics, the thermal interface between power module and heatsink becomes an even more important role. A thermal interface material must not only provide the lowest thermal resistance, but also fulfil the highest quality standards given for power modules to achieve the longest lifetime and highest system reliability.
Infineon challenges university research groups, research centers, individual inventosr and startups to develop a thermal interface material solution for highly reliable and best in class power modules.
Applications are open now on F6S: APPLY NOW
The deadline for applications is the 12th of September 2021.
For more information on the brief and technological details, visit https://www.inam.berlin/thermal-interface-materials-challenge
ABOUT INFINEON TECHNOLOGIES
Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon are the key to a better future. In the 2020 fiscal year (ending September 30), the company reported revenue of more than 8.5 billion euros with a workforce of 46,700 people worldwide. Following the acquisition of the US company Cypress Semiconductor Corporation in April 2020, Infineon is now a global top 10 semiconductor company. https://www.infineon.com/cms/en/