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OPEN INNOVATION CHALLENGE:
THERMAL INTERFACE MATERIALS 

for POWER MODULES

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ABOUT THE CHALLENGE

We are looking for thermal interface materials for power modules.

THE BRIEF

As the market leader in power modules, Infineon challenges YOU to develop a thermal interface material solution for highly reliable and best in class power modules.

 

Power modules serve, amongst others, general purpose drives, traction, servo-units and renewable energy applications like solar inverters, energy storage systems or wind applications. They cover a wide range of a few hundred Watts to several Megawatts.

 

However, with the ongoing demand and system requirement to increase the power density in power electronics, the thermal interface between power module and heatsink becomes an even more important role. A thermal interface material must not only provide the lowest thermal resistance, but also fulfil the highest quality standards given for power modules to achieve the longest lifetime and highest system reliability.

product/Material requirements

Your idea should focus on thermal interface materials based on foils, pastes, or potential other solutions. Foils and pastes ideally should meet following main requirements.

 

NOTE: Although these requirements are our ideal properties of thermal interface materials, don't hesitate to apply if one or two requirements are not met.

Thermal Conductivity

  • >= 6 W/(m*K)
    (through plane)
     

  • Standardization:
    ASTM D5470

     

  • Thermal conductivity may change max. 10% over
    12-15 years

Thermal contact resistance

  • < 5 K mm²/W
     

  • Standardization:
    ASTM D5470

     

  • Thermal contact resistance may change max. 20% over 12-15 years

thermal stability

No degradation at 150°C up to 2000h.

compressibility

Due to cavity changes of the base plate during operation (about 50 – 100µm cavity changes), the layer thickness between base plate and heatsink changes. The thermal interface material needs to compensate for those cavity changes.

shelf life

9 months before application on the power module.

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In addition, the following requirements are of secondary priority:

 

  •  Chemical compatibility: No emission of harmful gases up to 150°C.
     

  • Dimensional stability: No "corrugation“
     

  • Adhesion to Cu / Ni surfaces up to temperatures <50°C. Easy assembly and secure adhesion to Cu- & Ni-surfaces during transport up to 9 months

  • Dismount ability
     

  • Electrical insulation or no formation of electrically conductive particles during operation.
     

  • Max. particle size of the paste: 20µm (for pastes only).

participation requirements

  • You are a university research group, research center, individual inventor or startup.

  

  • You have developed an innovative technology, material or process, that could be used to address the described challenge.

Benefits

Ready to apply?

FOR STARTUPS

We will be taking applications on F6S from August 2nd to September 26th 2021. 

FOR reseachers

Apply now by filling out our application form. Deadline is September 26th 2021. 

timeline

1

APPLICATIONS


 

August 2nd -

September 26th 2021

2

 

SELECTION & PRESENTATIONS

 

October 2021

3

WINNERS ANNOUNCED
 


 

Mid - October

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Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon are the key to a better future. In the 2020 fiscal year (ending September 30), the company reported revenue of more than 8.5 billion euros with a workforce of 46,700 people worldwide. Following the acquisition of the US company Cypress Semiconductor Corporation in April 2020, Infineon is now a global top 10 semiconductor company.

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