How startups are rethinking thermal interface materials
Why thermal management is a critical design challenge
Thermal management has become a critical concern in modern electronics, power systems, and mobility technologies. As devices become more compact and operate at higher power densities, the ability to efficiently dissipate heat is no longer a secondary engineering task but a central performance and reliability factor.
Thermal Interface Materials (TIMs) play a vital role in this context by improving thermal contact between surfaces, thereby reducing thermal resistance. While traditional TIMs—such as greases and pads—have served their purpose for decades, the performance requirements of advanced semiconductor packaging, power electronics, and electric mobility applications now demand the development of next-generation materials.
4 key innovation areas in TIM development
Startups and researchers are working hard to rethink TIMs from the ground up. Recent innovation in TIMs is concentrated around four main areas, each driven by distinct technological and application demands:
1. High-Performance fillers: graphene, diamonds, and hybrid nanomaterials
Startups and researchers are incorporating nanomaterials such as graphene, carbon nanotubes, boron nitride, and synthetic diamond into polymer matrices to enhance thermal conductivity. These materials offer conductivities far beyond conventional fillers. However, challenges remain in achieving uniform dispersion, interface compatibility, and cost-effective production.
Demand for TIMs with thermal conductivity greater than10 W/m·K is growing especially for advanced semiconductor packaging like chiplets, power modules, and AI accelerators.
2. Directional thermal conductivity (anisotropy)
Thermal anisotropy is gaining attention in applications that require heat to be transferred along specific paths such as vertically stacked chips or densely packed battery modules. New materials are being designed with aligned particle structures, often using electric or magnetic fields during processing to control the orientation and optimize heat flow directionality.
3. Multifunctional TIMs
Modern systems require materials that not only transfer heat but also provide electrical insulation, mechanical stability, and electromagnetic interference (EMI) shielding. Composite TIMs offering these properties simultaneously are in demand, particularly in automotive and aerospace systems, where material consolidation and weight reduction are essential.
4. Sustainable and scalable production
To align with environmental and economic objectives, developers are exploring bio-based polymers, water-based formulations, and roll-to-roll manufacturing techniques. These approaches aim to reduce ecological impact while maintaining high performance and compatibility with automated assembly systems.
Startups driving innovation in TIM
Several startups from the INAM ecosystem are at the forefront of this transformation.
Graphenest (Portugal): An Advanced Materials Competition alumni, Graphenest develops graphene-enhanced composites that combine strong thermal conductivity with EMI shielding, offering lightweight alternatives to metal-based solutions. Their materials are targeting EVs, aerospace, and telecom infrastructure.
FibreCoat (Germany): FibreCoat’s thermoplastic coated glass fibre for innovative lightweight components provide quality and cost advantages, while enabling EMI shielding, radiation, and thermal protection for application in the automotive, construction, and aviation and defense sectors.
Diamond Materials (Germany): Manufactures chemical vapour deposition (CVD) diamond films with extremely high thermal conductivity, suitable for laser systems, RF components, and high-voltage electronics.
E Materials Lab (Korea): E Materials Lab has a patented heat dissipation solutions for the automotive, electronics and semiconductor sectors. Their solution achieves more than120% greater performance while using innovative materials allowing flexibility and a 50% reduction in weight compared to conventional components. Their solution is cheaper to produce and doubles the product life span.
Join us
For those committed to solving thermal challenges or intrigued by next-generation materials, the INAM network offers a straightforward way in. Whether you're a startup, corporation, investor, or researcher, you'll gain access to a growing ecosystem at INAM and the chance to be part of something bigger.
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