(Berlin, 11 August 2021) INAM – the Innovation Network for Advanced Materials, on behalf of Infineon Technologies AG, have organised an Open Innovation Challenge for Thermal Interface Materials for power modules.
Organizations use open innovation to access more diverse sources of ideas and talent. The goal is to find opportunities to solve unmet needs with the help of the right partnerships. INAM organises and hosts Open Innovation Challenges on behalf of their members as well as any interested parties who would like to expand the innovation potential of their organization.
This Open Innovation Challenge is based on Infineon’s search for thermal interface solutions for highly reliable and best in class power modules.
You can find power modules in general purpose drives, traction, servo-units and renewable energy applications like solar inverters, energy storage systems or wind applications. They cover a wide range of a few hundred Watts to several Megawatts.
However, with the ongoing demand and system requirements to increase the power density in power electronics, the thermal interface between power module and heatsink becomes an even more important role. A thermal interface material must not only provide the lowest thermal resistance, but also fulfil the highest quality standards given for power modules to achieve the longest lifetime and highest system reliability.
As the market leader in power modules, Infineon has created this challenge to find thermal interface material solutions for highly reliable and best in class power modules.
The winning team(s) will see their solution entering the market within the Infineon power module product portfolio.
The idea should focus on thermal interface materials based on foils, pastes, or potential other solutions. Foils and pastes ideally should meet the main requirements. These main requirements can be found on the challenge’s landing page on the INAM website:
The challenge is open to university research groups, research centers, individual inventors or startups who have developed an innovative technology that could be used to address the described challenge.
Applications are open now until the 12 September 2021. Soon after, the finalists will be selected and their presentations will be given in early October 2021. The winner(s) will be announced by mid-October 2021.
To apply, head to the Challenge’s F6S page:
About Infineon Technologies AG
Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon are the key to a better future. In the 2020 fiscal year (ending September 30), the company reported revenue of more than 8.5 billion euros with a workforce of 46,700 people worldwide. Following the acquisition of the US company Cypress Semiconductor Corporation in April 2020, Infineon is now a global top 10 semiconductor company.
For more information visit: https://www.infineon.com
INAM, the Innovation Network for Advanced Materials, is a global network of companies and research institutes in the field of Advanced Materials. INAM’s goal is to enable the right connections and make technological innovations become reality by working closely with startups, SMEs, corporations and research institutes to start, grow and transform the development of Advanced Materials.
For more information visit: https://www.inam.berlin/
11 August 2021 - Infineon Thermal Interface Challenge
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